This paper HTD PCB manufacturing experts will introduce three misunderstand.
If you have any questions about those Top three ignore point during PCB manufacturing, please feel free to contact us.
Our PCB manufacturing experts will reply ASAP.
1. Engineering design: the PCB design should note:
A. interlayer half curing chips, such as shall be symmetrical arrangement six layer PCB board, 1 ~ 2 and 5 ~ 6 layer thickness and half between the number of curing pieces shall be consistent, otherwise layer after pressing warps easily.
B. produce multilayer prototypes core board and half curing piece should use the same supplier"s products.
C. outer A face and side B circuit patterns should be as close to the area. If A surface for big copper surface, but B surface walked several thread only, this kind of printed circuit board after the etching is very easy to warp. If both sides of the line are far too big, can the area in dilute side add some independent grid, make the balance.
2. Before blanking baked board:
Copper clad material before baking plate (150 degrees Celsius, time 8 + 2 hours) purpose is to remove the moisture in the plate and also make the plank to fully cure within the resin, further eliminate plank of stress, which left to prevent plate wrpping is helpful. At present, many two-sided and produce multilayer prototypes still insist on next makings before or after baking plate this step. But there are some board factory exception, currently the PCB board of the time regulation also baking inconsistent from 4 to 10 hours, according to the production, the suggestion to the class of the PCB and client requirements to decide the warping degrees. Baked or cut makeup; after block after baking feeding, two methods are feasible Suggestions after cutting materials, baking plate. Lining board should also be baking plate.
3. Half curing slice of weft to:
Half cured by slice layer after pressing zonally shrinkage to and material and, as must distinguish the stack layer to and a zonally. Otherwise, layer after pressing is very easy to create the finished product, even add pressure plate wrpping baking plate also hard to correct. Produce multilayer prototypes of reasons, many warping is laminated half curing chips when pyrocondensation, disorderly diego to didn"t distinguish caused by the release.
How to distinguish jinwei to? Volumes of half cured by the direction of tablet is up to, and width direction is a zonally; It long sides of copper foil board zonally, when the shorter edges is to cannot be determined by, such as producer or supplier to query.
A. interlayer half curing chips, such as shall be symmetrical arrangement six layer PCB board, 1 ~ 2 and 5 ~ 6 layer thickness and half between the number of curing pieces shall be consistent, otherwise layer after pressing warps easily.
B. produce multilayer prototypes core board and half curing piece should use the same supplier"s products.
C. outer A face and side B circuit patterns should be as close to the area. If A surface for big copper surface, but B surface walked several thread only, this kind of printed circuit board after the etching is very easy to warp. If both sides of the line are far too big, can the area in dilute side add some independent grid, make the balance.
2. Before blanking baked board:
Copper clad material before baking plate (150 degrees Celsius, time 8 + 2 hours) purpose is to remove the moisture in the plate and also make the plank to fully cure within the resin, further eliminate plank of stress, which left to prevent plate wrpping is helpful. At present, many two-sided and produce multilayer prototypes still insist on next makings before or after baking plate this step. But there are some board factory exception, currently the PCB board of the time regulation also baking inconsistent from 4 to 10 hours, according to the production, the suggestion to the class of the PCB and client requirements to decide the warping degrees. Baked or cut makeup; after block after baking feeding, two methods are feasible Suggestions after cutting materials, baking plate. Lining board should also be baking plate.
3. Half curing slice of weft to:
Half cured by slice layer after pressing zonally shrinkage to and material and, as must distinguish the stack layer to and a zonally. Otherwise, layer after pressing is very easy to create the finished product, even add pressure plate wrpping baking plate also hard to correct. Produce multilayer prototypes of reasons, many warping is laminated half curing chips when pyrocondensation, disorderly diego to didn"t distinguish caused by the release.
How to distinguish jinwei to? Volumes of half cured by the direction of tablet is up to, and width direction is a zonally; It long sides of copper foil board zonally, when the shorter edges is to cannot be determined by, such as producer or supplier to query.
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