Soft board Function can be divided into four, respectively led Line (Lead Line), Printed Circuit (Printed Circuit), Connector, Connector and multi-functional integrated system (Integration of Function), application covers computer, computer peripheral auxiliary system, consumer minsheng electronics and automobile, etc.
COPPER Clad Laminater COPPER foil base plate (CCL)
CU (Copper foil) : condition and R.A. Copper foil
Cu Copper, Copper sheet is divided into RA, Rolled Annealed Copper and ED, Electrodeposited, both because of the different manufacturing principle, and characteristics are different, ED Copper manufacturing cost is low but fragile when doing Bend or Driver Copper surface body break easily.RA copper manufacturing cost but high flexible, so the FPC copper foil is given priority to with RA copper.
A (Adhesive), acrylic and thermosetting epoxy resin Adhesive
Rubber Adhesive for Acrylic Epoxy resin and Acrylic Mo Epoxy two big system.
PI (Kapton) : Polyimide (poly imide film)
PI for Polyimide abbreviations.In dupont Kapton, thickness unit is 1/1000 inch lmil.Features to be thin, high temperature resistance, strong resistance, good electrical insulation, FPC insulating layer are all brothers Kapton welding requirements.
Features:
Highly flexible, but solid wiring, according to the space limit change shape.High and low temperature resistance, resistance to burning.Folding without affecting the signal transfer function, can prevent electrostatic interference.
Chemical stability, stability and high reliability.
For the design of related products, can reduce assembly time and errors, and improve the service life of the products.
Application of product volume was reduced, significantly reduce weight, increase function, cost reduction.
Polyamide imide Resin, Polyimide Resin)
Polyamide imide resin is by oxygen layer and anhydrous pyromellitic acid reaction of polystyrene were represented by four acid imide, has five negative imide ring heat resistant resin known.
Polyamide imide resin is all high heat-resistant type one of the most widely USES in the polymer.It can cause such as polystyrene were four acid imide and other all sorts of inductor, at the same time also can make its function, so it is so versatile.Eps are four acid imide purposes though to it does not melt under large limitation, since the successful development as long as a little sacrifice its heat resistance can be made using solvent can make its melt or can melt forming polyamide imide, its USES widely up soon.
In printed circuit board with polyamide imide resin, heat resistance, pay attention to its formability and mechanical properties, dimensional stability, electrical properties, cost and other issues.So a lot of restrictions in the use.For these reasons, at present only a few addition polymerization type heat curing type polyamide imide is used for more than ten layers of multilayer printed circuit board.
The dosage of the future, however, believe that will continue to increase, the following table.In addition, flexible circuit board of the bottom of the protective film currently used are eps are still four acid imide.
Printed circuit board with conductors are thin foil of copper.Is the so-called copper foil.According to its process can be divided into electrolytic copper foil and rolled copper foil.
Function:
Stereo circuit connection between line hard printed circuit boards, movable type circuit, high density circuit.Commercial electronic equipment, car dashboard, printers, hard disk drive, diskette, fax machine, car mobile phone, general phones, laptops, etc.
High density thin printed circuit three-dimensional circuit camera, camera, cd-rom, hard disk, watches, etc
The connection of the connector board and low cost All kinds of electronic products
Multi-functional integrated system board and guide line and connector of the integration of computer, camera, medical instruments and equipment
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