The Theory of Electroplating Circuit Board
Electroplating is a process where metal ions are bonded to a metal surface.
The process requires a voltage potential between a copper source (anode) and the plating target (copper circuit).
Both the anode and copper circuit are immersed in a copper sulphate solution with an applied voltage potential.
The process requires a voltage potential between a copper source (anode) and the plating target (copper circuit).
Both the anode and copper circuit are immersed in a copper sulphate solution with an applied voltage potential.
The two most common methods for creating that conductive bridge are:
Electroless copper plating
Shadow plating
Shadow plating
Creating Conductive Bridge help electroplating between layers
This promotes ion flow from the anode to the cathode (the circuit).
Areas of a circuit panel with a voltage potential will get plated, so any part of a copper circuit that is electrically isolated will not get plated.
Since copper layers are separated by dielectric materials, and there is no electrical charge going through the through-hole, electroplating between layers is not possible. In order to allow electroplating, a conductive “bridge” must be coated over the insulating layer.
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Areas of a circuit panel with a voltage potential will get plated, so any part of a copper circuit that is electrically isolated will not get plated.
Since copper layers are separated by dielectric materials, and there is no electrical charge going through the through-hole, electroplating between layers is not possible. In order to allow electroplating, a conductive “bridge” must be coated over the insulating layer.
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