The definition of Buried Vias PCB manufacturing

The definition of Blind holes PCB manufacturing

Blind holes start on an outer layer but terminate on an inner layer.

The definition of Buried Vias PCB manufacturing

Buried Vias exist only between inner layers but do not begin or terminate on an outer layer.

The divided of Blind & Buried vias PCB manufacturing

Blind & Buried vias can be divided into two kinds, mechanical and laser.
Those two kind PCB holes is diviied by the PCB manufacturing process.
If you PCB manufacturing use mechanical to produce those hole,it’s named mechanical hole.

The benefit of Blind & Buried vias PCB manufacturing

Blind and buried vias help to reach PCB density by allowing features and lines to be designed above or below them without making a connection.
Lots of fine pitch BGA and flip-chip component footprints do not allow for running traces and through.
Instead, the blind and buried vias will only connect those layers that are required to have a connection in that specific area, allowing for PCB real estate space savings.

The use area of Blind & Buried vias PCB manufacturing

Blind and buried vias PCB, also known as HDI boards, often used for mobile phones, GPS navigation, wireless product, MID. Notebook.etc.

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8 Layer Blind Holes Printed Circuit Board
1+6+1 Stack up
FR4 1.0MM Thickness
1OZ finish Copper thickness
Immersion Gold Finish
Min Line/Space 3/3 mil
Gold Finger
Designed for Note Book

4 Layer Blind pcb
1+2+1 Stack up
FR4 1.6MM Thickness
3OZ finish Copper thickness
Immersion Gold Finish Surface Treatment
Min Line/Space 8/8 mil

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If you want to order our PCB,please mail to jim@htdcircuit.com