The OSP surface finish board has many different factors.
If you are familiar with Chemical theories.
You must know the Silver or the Tin material have a perfect performance.
But this feature also occurs when assembly components to surface finish boards.
This is the reason why so difficult use normal method assembly Silver or Tin surface finish.
Just because the Silver Surface finish or Tin Surface Finish have formed an intermetalic layer.
Unlike silver or tin the OSP doesn't form an intermetalic layer.
And the second different factor is the shelf life.
All electronic companies care about the OSP board's shelf life.
This also means the cost of PCB project.
This factor also related to first chemical theories.
Because the OSP surface finish doesn't have intimately layer.
The results in the short shelf life with OSP surface finish boards.
Then the third difference is solderability.
This factor also is mainly part of the PCB's performance.
If your boards have good solderability.
You purchase PCB order may high quality circuit boards.
So if you board is very low quality, and low performance.
Most of the time is saying PCBs' solderability.
In fact, the solderbility of OSP finish board not the best.
But it also can use most electronic products.
Even poor solderability of the other metallic finishes.
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