You should know PCB manufacturing trend 2017

In recent years, the Hayling Island Seminar has become established as the most popular date on the Institute of Circuit Technology calendar and, as expected, the 2016 event attracted a large gathering of industry professionals to the south coast of England to share knowledge and experience and to discuss current developments.

Made welcome by ICT Technical Director Bill Wilkie, delegates were treated to a series of presentations, not only on technology but also on utilization of social media in business, PCB market analysis, and some of the obstacles to be surmounted in starting a new PCB manufacturing plant in central Europe.

Andrew Barlow from MacDermid Enthone demonstrated how innovations in acid copper electroplating could help overcome some of the challenges of density and thermal management associated with modern HDI designs. Via filling and stacking had become established as a means of increasing interconnection density, but copper-filling of through-holes offered a more reliable process, with improved electrical and thermal conductivity. How could this be achieved by electroplating?

Clearly, substrate thickness and hole diameter were significant considerations, but the two-step process he described had already been shown to be successful for mechanically drilled holes as small as 0.2mm in substrates up to 0.8 mm thick, and work was in progress to extend the proven capability to include 0.15 mm holes in 0.45 mm substrates and 0.1 mm holes in 0.35 mm substrates. Laser-drilled “X-holes”, popular in mobile phone PCBs, were easier to fill, and nominal 0.15 mm holes in 0.2 mm thick substrates had been successfully demonstrated.

The key first step was to form a copper bridge at the centre of the hole, effectively closing it to create two opposed blind vias, before filling these blind vias with electroplated copper.

A very specialised procedure was required to form the bridges—solution agitation and electrical waveform were critical factors. Banks of eductors gave extremely high solution movement across the surface of the work—a typical working installation had 60 eductors on each side, directly impinging upon the cathode surface with a solution flow of 3 litres per minute per nozzle, and 100 tank turnovers of electrolyte per hour. This solution agitation was combined with knife edge mechanical agitation, with a 10 cm stroke at 6−12 cycles per minute.

With insoluble anodes and asynchronous PPR rectification specifically tuned to suit the hole sizes being bridged, and anode-cathode spacing of approximately 4 cm, best results were obtained if the range of hole diameters was kept to a minimum by the designer. Once the holes were bridged, the via-fill step employed an additive that was preferentially attracted to high-current-density areas so that electrodeposition was favoured at the bottom of the blind vias, so that they became progressively filled with copper without excessive deposition on the surface. Cycle times varied depending on via size, but 75 minutes was typical.

Barlow showed many examples of microsections and X-rays confirming void-free hole-filling, and no cracking or adhesion loss between copper interfaces had been observed after 6 x 10 second solder shocks at 288°C. End markets for the bridge-and-fill technology included IC substrates, LED, military, aerospace and automotive.

Dr. Despina Moschou, until recently a research fellow at the University of Southampton and currently Prize Fellow in Bioelectronics at the University of Bath, gave a fascinating presentation on “Lab-on-PCB” technology for medical diagnostic applications. “In the micro-scale, things change in the fluidics of fluids,” she began her introduction to microfluidics: miniaturised systems to bring together microscopic volumes of liquids, transducers and microelectronic components to form biosensors. She went on to describe the characteristics of microfluidic chips, which had micro-channels etched or moulded into a glass, silicon or polymer substrate. The micro-channels forming the microfluidic chip were interconnected to perform functions such as mixing, pumping and sorting, and connected to the outside by inlets and outlets pierced through the chip. The trend towards smarter multi-functional microchips had resulted in the micro total analysis systems known as “Lab-on-a-Chip”: integrated systems of reduced size and weight, performing sample handling steps and analytical measurements faster, at lower cost and with less chance of human error than traditional techniques.

“Lab-on-PCB,” originally suggested in the 1990s as a cost-effective integration platform but side-lined by easier microfluidic fabrication processes, had recently become a main focus of attention because the long-standing industrial infrastructure of PCB technology enabled low-cost upscaling and currently offered adequate microfabrication capabilities: it was not necessary to work at the nanometre scale—100-micron technology was sufficient.

Dr. Moschou illustrated fluidic controls such as microvalves and micro pumps that had been integrated into PCBs, described various biosensor devices and discussed the results of the collaborative ELISA project, which had used exclusively PCB manufacturing techniques to successfully fabricate a 3-layer multilayer lab-on-PCB measuring 4.6 cm x 5.7 cm with reference electrodes in layer 1, sensing electrodes in layer 2 and microfluidics in layer 3. There was significant interest both from academia and from industry in further developing the Lab-on-PCB concept.

Ken Ball from techUK, the association representing technical businesses in the UK, took a slot in the seminar programme at short notice with news from the Export Control Reform working group about updates to open general export licences (OGELs) for the export of “low risk” electronics components, which covered PCBs and components for military goods and for PCBs and components for dual-use items. Military OGEL applications covered all countries except Afghanistan, Argentina, Armenia, Azerbaijan, Belarus, Burma, Central African Republic, Democratic Republic of Congo, Eritrea, Iran, Iraq, Ivory Coast, Lebanon, Liberia, Libya, North Korea, Pakistan, People’s Republic of China, Russian Federation, Somalia, South Sudan, Sudan, Syria, Yemen and Zimbabwe. He also commented on business issues regarding digital licencing and apprenticeship levies, and that techUK was seeking opinion from British industry on the possible consequences of “Brexit,” in order to feed concerns back to government.

The seminar took on a different dimension when Daniel Knowlton literally leapt into action with an energetic and animated promotion of social media as tools for growing businesses. “Get to grips with digital marketing, it’s hugely, hugely, hugely powerful! After today you will all be inspired to use social media!” he confidently predicted. “Marketing is all about attention. It used to be print and billboards—if you’re not changing with the times, you’re going to get eaten up. Become part of an on-line community—it’s a great way to develop presence and brand awareness, build relationships and generate sales! Become a key centre of influence! The average user spends 2.3 hours a day on social media—people are forever checking their phones to be up to speed with what’s happening and to make sure they’re not missing out!”

 “Who is this bloke, and why should I listen to him?” was the rhetorical question he asked the audience, before cataloguing his credentials, which included being one of the world’s top 100 influential people in digital marketing and having won an award as social media business of the year.

While moving around a lot, talking very fast and referring to strange-sounding websites, he commanded the attention of the audience as he listed five steps to social media success:

Step 1: Find out who are the highly influential people in your industry, using sites like Followerwonk, and what information they are sharing, using sites like Buzzsumo, Socialmediaexaminer, Bufferblog and Blog.Bufferap.

Step 2: Use free resources to learn.

Step 3: Follow the influencers.

Step 4: Create an action plan.

Step 5: Measure success using social media analytics like KLOUT.

Son of business improvement specialist Mark Knowlton, a popular contributor to ICT events on the subject of Lean manufacturing, Daniel Knowlton certainly left an impression on his audience. How applicable his techniques would be in the high-end electronics business, how inspired the specialist PCB manufacturer would be to use social media to supplement his direct technical sales effort will remain to be seen. The community printed circuit board platform Ragworm has already demonstrated the effectiveness of social media in driving its basic PCB prototyping service. Maybe the industry establishment should open its eyes, take notice of the ideas of an eager up-coming generation and recognise the influence they will have on the industry’s future…

Back to normality: Market analyst and ICT council member Francesca Stern gave her latest outlook on the PCB and electronics industries, based on UK and global trends in electronics production and the PCB production supporting it. Excluding components, global electronics production in 2015 was £980 billion, of which Europe’s share was about £150 billion with the UK contributing about £12.5 billion. UK PCB production in 2015 had been estimated at £125 million, against a market demand in excess of £168 million.

Electronics equipment production in Europe and North America remained relatively strong in industrial, instrumentation and automation in 2015, whereas military expenditure had been low to flat, but was forecast to creep up in 2016. UK electronics production had declined slightly in 2015 and continued to decline in the first half of 2016, more in the export market than the home market. PCB production had declined in Europe in 2015 and there had been some recovery in 2016 but no growth yet, although it was forecast to go positive in late 2016 or early 2017. PCB production in the UK was following a similar trend. There was low growth in North America and further decline in Japan. Measured in domestic currencies, there had been some growth in Asia but exchange rate changes meant that this was negative if converted to US dollars.

Exchange rates were a sensitive topic as the seminar programme concluded with the last-minute arrival of dare-to-be-different SCL PCB Solutions Group CEO Steve Driver, just back from Romania with an update on his PCB factory start-up there and comments on the repercussions of the “Brexit” referendum. In his opinion, the decision to leave the European Union was horrible news, and a lot of damage had already been done to the UK and to the PCB industry. For a company like Spirit Circuits, a significant proportion of whose business involved imported PCBs paid for in U.S. dollars, the plunge in the value of the pound had major financial consequences. And imported materials and equipment would inevitably cost more—all hurting cash flow and profitability. “We’re all in the same boat—we just have to keep calm, hunker down and take actions!”

What was the latest on the Romanian enterprise? “I’ve never worked so hard!” Romanian bureaucracy continued to frustrate his efforts to get the operation into production. He had only gained access to the industrial unit three weeks before, and his advance team of 16 people was working ‘round the clock to get the basic factory infrastructure into place—cleaning, digging holes, laying concrete. And Driver was still awaiting formal authorisation to use the building for PCB manufacture. “The principle of it being better to seek forgiveness than to ask permission doesn’t work in Romania!” he commented, taking as an example a document 142 pages long with stamps—“they’re obsessed with them!”—on every page. The bureaucracy was also causing delays in obtaining waste water permissions and establishing electricity supplies.

But Driver was determined to see the project through. The advance team had undergone six months training in the UK; the plan was to extend the workforce to 41 by January 2017 and to 100 later in the year. Three trucks-full of equipment were already in Romania, another five were loaded and ready to go, and pilot production was scheduled to start in December. Steve Driver thrives on challenges, and no one in the room was in any doubt that the obstacles would be overcome one way or another.

Hayling Island lived up to expectations—once again an excellent technical seminar and learning opportunity, a tribute to Bill Wilkie’s organisational skills and the generous support of Macdermid-Enthone and Spirit Circuits, and a premier be-there-or-miss-out networking event for the UK PCB industry.
Source:iconnect007

Some points your HDI PCB manufacturer don't want you know

This paper is focus on Some points your HDI PCB manufacturer don't want you know.
If you want to learn more PCB manufacturer info, please contact us.

HDI PCBs are printed circuit boards with a much higher wiring and pad connection density than a traditional PCB.
HDI PCBs are characterized by finer lines, closer spaces, smaller capture pads, and micro-sized vias.
HDI PCB manufacturing is a growing area since the market demand for lightweight and thinner PCBs that can handle high-speed signals with reduced signal loss has steadily increased as consumer electronic end-products are produced in smaller form factors.

As a result of the market demand for HDI PCB manufacturing, there were many industries, including:

Automotive (Engine Control Units, GPS, Dashboard Electronics)
Computers (Laptops, Tablets, Wearable Electronics, Internet of Things - IoT)
Communication (Mobile phones, Modules, Routers, Switches)
Digitial (Cameras, Audio, Video)

Copare the cost of flex or rigid-flex with standard rigid PCB

PCB design engineers often ask if it costs more to build a flex or rigid-flex than it does a standard rigid PCB.  Obviously, there are inherent cost adders to both types of design so it isn’t quite a simple as an X vs. Y answer.  Below some of the information may be helpful for design engineers trying to flush out what might be the best path to take.

If we start with the assumption that the rigid PCB has been the “standard” build (and we can look at the variety of cost adders below) it might be good to determine if any of the following benefits of a flex or rigid-flex are a target of the project being considered.

Need for small/lightweight circuit
Foldable to conform to varied 3-D shapes
Better space utilization in end product
High reliability/integrated cabling (reduce the number of connectors)
High reliability during dynamic bending applications
Wide latitude of design concepts
High shock and vibration resistance
 In a rigid PCB we see four major cost drivers.  These would include:

# of layers. Each add’l 2 layers will add app. 20% based on material and lamination costs. HDI can be used to reduce layer count if HDI cost offsets layer count cost.
Hole size/# of drills will impact cost. Large # and small drill sizes will impact cost (usually staying above .25mm drill size will have no cost impact).
Spacing of hole-to-pad. Keeping a 4 mil space is normally sufficient to not warrant any cost adder.
Trace/Space. Always something to take into consideration.  If above 4/4 there shouldn’t be any cost adder.  Oftentimes, you can get to 3/3 without a cost adder but this wouldn’t be applicable across all manufacturers.
 In a rigid-flex and flex design the major cost adders would include:

Panel utilization is a very BIG cost factor for flex and rigid-flex PCB. Understanding what panel size the manufacturers use and then maximizing your design and layout to utilize as many units per panel can dramatically impact cost.
Types of material callouts for both the polyimide and cover layers may have cost impact.
Layer count of both the rigid (see above) and flex portions of the design will have a cost impact.
Types of stiffener being spec’d and surface finish callouts could have some cost impact (FR4 stiffener and ENIG on lower end of cost scale).
 Since function is the most important part of PCB design, cost factors normally don’t come into the discussion until after the design is created.  This oftentimes puts function, quality, and cost targets all at odds with each other.  With some information up front on cost drivers and having an understanding if the end product being designed is “highly” cost sensitive or not may help guide the PCB designer into the most efficient design for the product.

Top 5 impact factor on the impedance control

Top 5 impact factor on the impedance control In the normal PCB design conditions, the following factors mainly caused by the PCB manufacturing impact on the impedance: 1, the dielectric layer thickness and impedance value is proportional to. 2, the dielectric constant and inversely proportional to the impedance value. 3, copper foil thickness and resistance value is inversely proportional. 4, line width and impedance value is inversely proportional. 5, the ink thickness and resistance value is inversely proportional. So we should pay attention to the above points in the control of impedance.

Three Common sense of Flexible circuit board

Flexible circuit board Product description

Flexible circuit board (FPC) is made of a kind of laminated material that has insulation to resist heat, electrical properties, metal foil, and adhesive. Usually, conductive bumps allow conductivity between the flexible circuit board and another circuit board by pressing the bumps to pads with pressure. This creates electric flow between the systems. Flexible circuit boards are known for their lightness, thinness, flexibility, and convenience in size.

FPC has several advantages in many applications:
1) Tightly assembled electronic packages, where electrical connections are required in 3 axes, such as cameras (static application).
2) Electrical connections where the assembly is required to flex during its normal use, such as folding cell phones (dynamic application).
3) Electrical connections between sub-assemblies to replace wire harnesses, which are heavier and bulkier, such as in cars, rockets and satellites.
4) Electrical connections where board thickness or space constraints are driving factors.

Applications of Flexible circuit board

> FPCs are often used as connectors in various applications where flexibility, space savings, or production constraints limit the serviceability of rigid circuit boards or hand wiring. In addition to cameras, a common application of flex circuits is in computer keyboard manufacturing; most keyboards made today use flex circuits for the switch matrix.

Common structures of Flexible circuit board

1) Single side:
   A single-conductor flex circuit is often employed as an inter-connect, either using connectors, or soldered directly to pads on the board using techniques such as hot bar soldering.  
 2) Double sides:
Flex circuits with two conductive layers can be made with or without plated through-holes, though through-holes are usually provided. As with the single-layer circuit, apertures can be cut in the cover layer to allow assembly on one or both sides.
 3) Single side double access
Applied with single sided material to make pattern but make some window on base film and add on cover layer on pattern top. The final products will have single layer copper but two side access possibility. This structure we call that single side double access boards.  
 4) Single side plus single side
Binding two single sided FPC by end point joint. The bending area will be non adhesive for getting better flexibility. This structure so called single side plus single side with air gap.
 5) Multi-layers
 Binding several boards together so called Multi-layer and the drawing show here is an example of binding a single sided and a double sided FPC together.
6) COF (Clip-on-film)
7) Rigid-flex board

Do you know FLEX Southeast Asia?

The latest conference is called FLEX Southeast Asia 2016.
Here are some simple introduce below:


Flexible printed electronics, one of the growing technologies in the world, is fast becoming mainstream. With the rise of Internet of Things (IoT), printed electronics offers tremendous opportunities in creating and integrating smart systems, devices and wearables for everyday use at low cost. At compound annual growth rate of more than 33%, the printed electronics sector is projected to reach a market value of over USD40 billion by year 2020.

Organised by SEMI FlexTech Alliance and supported by Agency for Science, Technology and Research’s Singapore Institute of Manufacturing Technology (SIMTech), FLEX Southeast Asia 2016 conference presents an overview on the convergence of semiconductors and large area printed electronics to create flexible yet affordable hybrid electronics. The conference features a comprehensive range of topics on semiconductors, printed electronics as well as the potential applications and challenges in integrating printed electronics into semiconductor devices. The conference promises to be an insightful platform for one to explore the opportunities that comes with the convergence of two traditionally distinct sectors to develop products of the future.

Alongside with the conference, a printed electronics exhibition showcasing the latest innovations and development in this emerging sector will be also present to facilitate interaction and learning between end-users, manufacturers, system integrators and potential players.

Get your own customized PCBs to serve your multiple project purpose

The rapid growth of technology has been able to make our lives easier and luxurious. The machine dependent works are now less time-consuming and smoother. This continuous technological growth and the electronics world have a symbiotic relation between each other. We cannot expect a day without the help of electronics. And the increasing aura of electronics is much dependent on the use of printed circuit boards, abbreviated as PCBs.

PCBs are a pathway to mechanically hold and electrically connect different types of electronic devices within a small piece of board that can be used as a standard in many electronics projects. The electronic components are connected through some conductive material on a non-conductive board. Mainly copper is used as the connecting material as copper is much cheaper than the other conductive materials. The PCB makers in china have proved themselves as one of the biggest PCB markets. There is a variety of online marketing platforms that accept PCB online quotes. Many of the PCB manufacturers accept quotes from customers worldwide. In spite of the challenges like different time zones, language difference and the cultural difference the companies have been able to serve the overseas customers and grow their business.

Along with the standard PCBs sometimes you may need to get your own customized PCBs to serve your multiple project purpose. There is also an option to submit your quote online to get a custom PCB. All you need to do is:

• Mention the type of material you want to print your PCB on.

• Mention the specifications of your customized PCB.

• Get a quote instantly. The payment issues may differ for different manufacturers.

There are PCBs in the market containing a number of layers from 2 to 12. You can choose any number of layers according to your need. You can also get a flexible PCB that works as a connector as well as a PCB to make your job easier. Flex PCBs need no external connector when used in making circuits. You can also get your online PCB quotes for flexible customized PCBs. The PCBs can be made by printing on one side or both sides.

So whether you want a custom PCB or a standard one, you can submit your quote whenever and wherever you need. All you need is to be specific about your requirements. Or you might end up being delivered a wrong product. So go ahead and submit your PCB quote…..your customized PCB is just a click away from you!

Source: http://www.htdcircuits.com/getting-an-online-pcb-quote-was-never-so-easy-.html